Home ProductsSEMICONDUCTOR MATERIAL

4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

    • 4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device
    • 4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device
    • 4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device
    • 4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device
  • 4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

    Product Details:

    Place of Origin: Guangdong, China
    Brand Name: ANG
    Certification: ISO
    Model Number: SIC-W05

    Payment & Shipping Terms:

    Minimum Order Quantity: 100
    Price: Depends on size and quantity
    Packaging Details: Singer Wafer in 100 Grade Cleaning Room
    Delivery Time: 8~10 working days
    Payment Terms: T/T, Western Union,Paypal
    Supply Ability: 500,000pcs per month
    Contact Now
    Detailed Product Description
    Color: Green Mpd: <2cm-2
    Size: <2cm-2 Transport Package: Singer Wafer In 100 Grade Cleaning Room

    4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

     

     

    Regarding Silicon Carbide(SiC) Crystal

    Silicon carbide (SiC), also known as carborundum, is a semiconductor containing silicon and carbon with chemical formula SiC. SiC is used in semiconductor electronics devices that operate at high temperatures or high voltages, or both.SiC is also one of the important LED components, it is a popular substrate for growing GaN devices, and it also serves as a heat spreader in high-power LEDs.

     

    SiC Application

    1. high frequency and high power electronic devices Schottky diodes, JFET, BJT, PiN,diodes, IGBT, MOSFET
    2. optoelectronic devices: mainly used in GaN/SiC blue LED substrate material (GaN/SiC) LED



    Specification

    Grade
    Zero MPD Grade
    Production Grade
    Research Grade
    Dummy Grade
    Diameter
    50.6mm±0.2mm
    Thickness
    1000±25um Or other customized thickness
    Wafer Orientation
    Off axis : 4.0° toward <1120> ±0.5° for 4H-N/4H-SI On axis : <0001>±0.5° for 6H-N/6H-SI/4H-N/4H-SI
    Micropipe Density
    ≤0 cm-2
    ≤2 cm-2
    ≤5 cm-2
    ≤30 cm-2
    Resistivity 4H-N
    0.015~0.028 Ω•cm
    Resistivity 4/6H-SI
    ≥1E7 Ω·cm
    Primary Flat
    {10-10}±5.0° or round shape
    Primary Flat Length
    18.5 mm±2.0 mm or round shape
    Secondary Flat Length
    10.0mm±2.0 mm
    Secondary Flat Orientation
    Silicon face up: 90° CW. from Prime flat ±5.0°
    Edge exclusion
    1 mm
    TTV/Bow /Warp
    ≤10μm /≤10μm /≤15μm
    Roughness
    Polish Ra≤1 nm / CMP Ra≤0.5 nm
    Cracks by high intensity light
    None
    1 allowed, ≤2 mm
    Cumulative length ≤ 10mm, single length≤2mm
    Hex Plates by high intensity light
    Cumulative area ≤1%
    Cumulative area ≤1%
    Cumulative area ≤3%
    Polytype Areas by high intensity light
    None
    Cumulative area ≤2%
    Cumulative area ≤5%
    Scratches by high intensity light
    3 scratches to 1×wafer diameter cumulative length
    5 scratches to 1×wafer diameter cumulative length
    5 scratches to 1×wafer diameter cumulative length
    edge chip
    None
    3 allowed, ≤0.5 mm each
    5 allowed, ≤1 mm each

     

    Common Size In Stock

    4H-N Type / High Purity SiC wafer/ingots

    2 inch 4H N-Type SiC wafer/ingots
    3 inch 4H N-Type SiC wafer
    4 inch 4H N-Type SiC wafer/ingots
    6 inch 4H N-Type SiC wafer/ingots

    4H Semi-insulating / High Purity SiC wafer

    2 inch 4H Semi-insulating SiC wafer
    3 inch 4H Semi-insulating SiC wafer
    4 inch 4H Semi-insulating SiC wafer
    6 inch 4H Semi-insulating SiC wafer
     
     
    6H N-Type SiC wafer
    2 inch 6H N-Type SiC wafer/ingot
    Customzied size for 2-6inch
     

     

    Product Picture

    4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

     

    PACKAGE

    4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

    4h-N Semi Silicon Carbide Wafer Sic Substrate Wafer for MOS Device

     

    Contact Details
    Shenzhen A.N.G Technology Co., Ltd

    Contact Person: Miss. Dora

    Tel: 86-755-26407256

    Send your inquiry directly to us (0 / 3000)

    Other Products